JPH087661Y2 - ワイヤクランパ - Google Patents
ワイヤクランパInfo
- Publication number
- JPH087661Y2 JPH087661Y2 JP1989019610U JP1961089U JPH087661Y2 JP H087661 Y2 JPH087661 Y2 JP H087661Y2 JP 1989019610 U JP1989019610 U JP 1989019610U JP 1961089 U JP1961089 U JP 1961089U JP H087661 Y2 JPH087661 Y2 JP H087661Y2
- Authority
- JP
- Japan
- Prior art keywords
- clip
- wire
- base
- base portion
- clamper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002390 adhesive tape Substances 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 9
- 239000011810 insulating material Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Clamps And Clips (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989019610U JPH087661Y2 (ja) | 1989-02-23 | 1989-02-23 | ワイヤクランパ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989019610U JPH087661Y2 (ja) | 1989-02-23 | 1989-02-23 | ワイヤクランパ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02113381U JPH02113381U (en]) | 1990-09-11 |
JPH087661Y2 true JPH087661Y2 (ja) | 1996-03-04 |
Family
ID=31235272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989019610U Expired - Lifetime JPH087661Y2 (ja) | 1989-02-23 | 1989-02-23 | ワイヤクランパ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH087661Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0541580Y2 (en]) * | 1987-05-19 | 1993-10-20 |
-
1989
- 1989-02-23 JP JP1989019610U patent/JPH087661Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02113381U (en]) | 1990-09-11 |
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